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revisions ltr description date (yr-mo-da) approved a added case outline letter u to the drawing. removed esds requirements from drawing. editorial changes throughout. 90-01-26 m. a. frye b changes in accordance with nor 5962-r117-92 92-01-27 m. a. frye c redrawn with changes. add device type 05. add software data protect. added vendor cage 60395 and 61394 as approved sources. editorial changes throughout. 92-12-18 m.a. frye d changes in accordance with nor 5962-r216-93 93-08-20 m.a. frye e updated boilerplate. removed data retention and endurance tests from drawing. removed programmi ng specifics from drawing. - glg 00-08-07 raymond monnin f boilerplate update and part of five year review. tcr 07-03-29 robert m. heber rev sheet rev f f f f f sheet 15 16 17 18 19 rev status rev f f f f f f f f f f f f f f of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by kenneth rice defense supply center columbus standard microcircuit drawing checked by ray monnin columbus, ohio 43218-3990 http://www.d scc.dla.mil this drawing is available for use by all departments approved by michael a. frye microcircuit, memory, digital, cmos, 32k x 8 eeprom, monolithic silicon and agencies of the department of defense drawing approval date 89-02-13 amsc n/a revision level f size a cage code 67264 5962-88634 sheet 1 of 19 dscc form 2233 apr 97 5962-e270-07
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing describes device requirements for mil-st d-883 compliant, non-jan class level b microcircuits in accordance with mil-prf-38535, appendix a. 1.2 part or identifying number (pin) . the complete pin shall be as shown in the following example: 5962-88634 01 u a drawing number device type (see 1.2.1) case outline (see 1.2.2) lead finish (see 1.2.3) 1.2.1 device type(s) . the device type(s) identify the circuit function as follows: device generic circuit access write type number function time speed write mode end of write indicator endurance 01 see 6.6 32k x 8 eeprom 120 ns 10 ms byte/page data polling/toggle bit 10,000 cycles 02 see 6.6 32k x 8 eeprom 120 ns 3 ms byte/page data polling/toggle bit 10,000 cycles 03 see 6.6 32k x 8 eeprom 90 ns 10 ms byte/page data polling/toggle bit 10,000 cycles 04 see 6.6 32k x 8 eeprom 90 ns 3 ms byte/page data polling/toggle bit 10,000 cycles 05 see 6.6 32k x 8 eeprom 70 ns 10 ms byte/page data polling/toggle bit 10,000 cycles 1.2.2 case outline(s) . the case outline(s) are as des ignated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style u see figure 1 28 pin grid array x gdip1-t28 or cdip2-t28 28 dual-in-line y cqcc1-n32 32 rectangular leadless chip carrier z cdfp4-f28 28 flat pack 1.3 absolute maximum ratings . 1 / supply voltage range (v cc ) ........................................................-0.3 v dc to +6.25 v dc storage temperature r ange ........................................................ -65c to +150c maximum power dissipation (p d ) ...............................................1.0 w lead temperature (solderi ng, 10 seconds ).................................+300c junction temperature (t j ) 2 /......................................................+ 175c thermal resistance, junction-to-case ( jc ) .................................see mi l-std-1835 input voltage range (v il , v ih )......................................................-0.3 v dc to +6.25 v dc data retent ion ............................................................................ 20 years (minimum) endurance ..................................................................................10, 000 cycles (minimum) chip clear voltage (v h ) ...............................................................13.0 v dc 1.4 recommended operating conditions . 1 / supply voltage range (v cc ) ........................................................+4.5 v dc to +5.5 v dc case operating temperature range (t c ) .....................................-55c to +125c input voltage, low range (v il ) .....................................................-0.1 v dc to +0.8 v dc input voltage, high range (v ih ) ...................................................+2.0 v dc to v cc + 0.3 v dc 1 / all voltages are referenced to v ss (ground). 2 / maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of mil-std-883.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 3 dscc form 2234 apr 97 2. applicable documents 2.1 government specif ication, standards, and handbooks . the following specificati on, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of thes e documents are those cited in t he solicitation or contract. department of defense specification mil-prf-38535 - integrated circuits, manufacturing, general specification for. department of defense standards mil-std-883 - test me thod standard microcircuits. mil-std-1835 - interface standard electronic component case outlines. department of defense handbooks mil-hdbk-103 - list of st andard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.3 order of precedence . in the event of a conflict between the text of this drawing and the refe rences cited herei n, the text of this drawing takes precedence. nothing in this documen t, however, supersedes applicable laws and regulations unless a specific exempti on has been obtained. 3. requirements 3.1 item requirements . the individual item requirements shall be in accordance with mil-prf-38535, appendix a for non-jan class level b devices and as specified herei n. product built to this drawing that is produced by a qualified manufacturer list ing (qml) certified and qualified m anufacturer or a manufacturer who has been grant ed transitional certific ation to mil-prf-38535 may be processed as qml product in accordance with the manuf acturers approved program plan and qualifying activity approval in accordance with mil-prf-38535. this qml flow as documented in the quality management (qm) plan may make modifications to the requirements herein. these modifications shall not affect form, fit, or function of the device. these modifications shall not affect the pin as described herein. a "q" or "qml" certific ation mark in accordance with mil-prf-38535 is required to identify when t he qml flow option is used. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil-prf-38535, appendix a and herein. 3.2.1 terminal connections . the terminal connections shall be as specified on figure 2. 3.2.2 truth table(s) . the truth table(s) for unprogrammed dev ices shall be as specified on figure 3. 3.2.2.1 programmed devices . the requirements for supplying programmed devices are not part of this drawing. 3.2.3 case outlines . the case outlines shall be in acco rdance with figure 1 and 1.2.2 herein. 3.3 electrical performance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full case operati ng temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii. the electrical tests for each subgroup are described in table i. 3.5 marking . marking shall be in accordance with mil-prf-38535, appendix a. the part shall be marked with the pin listed in 1.2 herein. in addition, the manufactu rer's pin may also be marked. for pack ages where marking of the entire smd pin number is not feasible due to space limit ations, the manufacturer has the option of not marki ng the "5962-" on the device. 3.5.1 certificat ion/compliance mark . a compliance indicator ?c? shall be marked on all non-jan devices built in compliance to mil-prf-38535, appendix a. the compliance indicator ?c? sha ll be replaced with a "q" or "q ml" certification mark in accordance with mil-prf-38535 to identif y when the qml flow option is used.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 4 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions -55 c t c +125 c v ss = 0 v, 4.5 v < v cc < 5.5 v, unless otherwise specified 1 / group a subgroups device type limits unit min max supply current i cc1 ce = oe = v il , we = v ih , 1, 2, 3 all 80 ma (operating) all i/o's = 0.0 ma, inputs = v cc = 5.5 v, t avav = t avav (min) supply current i cc2 ce = v ih , oe = v il , 1, 2, 3 01, 02 3 ma (ttl standby) all i/o's = 0.0 ma, 03, 04, 60 inputs = v cc - 0.3 v, f = 0.0 mhz 05 supply current i cc3 ce = v cc - 0.3 v, 1, 2, 3 01, 02 350 a (cmos standby) all i/o's = 0.0 ma, 03, 04, 60 ma inputs = v il or v cc - 0.3 v, f = 0.0 mhz 05 input leakage (high) i ih v in = 5.5 v 1, 2, 3 all 10 a input leakage (low) i il v in = 0.1 v 1, 2, 3 all -10 a output leakage (high) i ohz v out = 5.5 v, ce = v ih 2 / 1, 2, 3 all 10 a output leakage (low) i olz v out = 0.1 v, ce = v ih 2 / 1, 2, 3 all -10 a input voltage low v il 1, 2, 3 all -0.1 0.8 v input voltage high v ih 1, 2, 3 all 2.0 v cc v +0.3 v output voltage low v ol i ol = 6.0 ma, v ih = 2.0 v, 1, 2, 3 all 0.45 v v cc = 4.5 v, v il = 0.8 v output voltage high v oh i oh = -4.0 ma, v ih = 2.0 v, 1, 2, 3 all 2.4 v v cc = 4.5 v, v il = 0.8 v see footnotes at end of table.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 5 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions -55 c t c +125 c v ss = 0 v, 4.5 v < v cc < 5.5 v, unless otherwise specified 1 / group a subgroups device type limits unit min max oe high leakage i oe v h = 13 v 1, 2, 3 all -10 100 a (chip erase) input capacitance c i v i = 0 v, v cc = 5.0 v, 4 all 10 pf t a = +25c, f = 1 mhz, see 4.3.1c 3 / 4 / output capacitance c o v o = 0 v, v cc = 5.0 v, 4 all 10 pf t a = +25c, f = 1 mhz, see 4.3.1c 3 / 4 / read cycle time t avav see figure 4 5 / 9, 10, 11 01, 02 120 ns 03, 04 90 05 70 address access time t avqv 9, 10, 11 01, 02 120 ns 03, 04 90 05 70 chip enable t elqv 9, 10, 11 01, 02 120 ns 03, 04 90 access time 05 70 output enable access t olqv 9, 10, 11 01, 02 50 ns 03, 04, 05 40 chip enable to output t elqx 9, 10, 11 all 10 ns in low z 4 / see footnotes at end of table.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions -55 c t c +125 c v ss = 0 v, 4.5 v < v cc < 5.5 v, unless otherwise specified 1 / group a subgroups device type limits unit min max chip disable to output t ehqz see figure 4 5 / 9, 10, 11 01, 02 50 ns in high z 4 / 03, 04, 05 40 output enable to t olqx 9, 10, 11 all 10 ns output in low z 4 / output disable to t ohqx 9, 10, 11 01, 02 50 ns output in high z 4 / 03, 04, 05 40 output hold from t axqx 9, 10, 11 all 0 ns address change write cycle time t whwl1 9, 10, 11 01, 03, 05 10 ms t ehel1 02, 04 3 address setup time t avel 9, 10, 11 all 20 ns t avwl address hold time t elax 9, 10, 11 all 50 ns t wlax write setup time t wlel 9, 10, 11 all 0 ns t elwl write hold time t ehwh 9, 10, 11 all 0 ns t wheh see footnotes at end of table.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 7 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions -55 c t c +125 c v ss = 0 v, 4.5 v < v cc < 5.5 v, unless otherwise specified 1 / group a subgroups device type limits unit min max oe setup time t ohel see figure 4 5 / 9, 10, 11 all 0 ns t ohwl oe hold time t ehol 9, 10, 11 all 0 ns t whol we pulse width t eleh 9, 10, 11 all 150 ns t wlwh data setup time t dveh 9, 10, 11 all 50 ns t dvwh data hold time t ehdx 9, 10, 11 all 0 ns t whdx byte load cycle t whwl2 9, 10, 11 all .20 149 s last byte loaded to t whel 9, 10, 11 all 0 ns data polling 4 / t ehel ce setup time t elwl1 9, 10, 11 all 5 s output setup time t ovhwl 9, 10, 11 all 5 s ce hold time t wheh1 9, 10, 11 all 5 s oe hold time t whoh 9, 10, 11 all 5 s see footnotes at end of table.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 8 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions -55 c t c +125 c v ss = 0 v, 4.5 v < v cc < 5.5 v, unless otherwise specified 1 / group a subgroups device type limits unit min max high voltage v h see figure 4 5 / 9, 10, 11 all 12 13 v chip erase t wlwh2 9, 10, 11 all 210 ms we pulse width for t wlwh1 9, 10, 11 all 10 ms chip erase 1 / dc and read mode. 2 / connect all address inputs and oe to v ih and measure i olz and i ohz with the output under test connected to v out . 3 / all pins not being tested are to be open. 4 / tested initially and after any design or process changes that affect that parameter, and t herefore shall be guaranteed to th e limits specified in table i. 5 / tested by application of specifi ed timing signals and conditions, including: equivalent ac test conditions for all device types: output load: 1 ttl gate and c l = 100 pf (minimum) or equivalent circuit. input rise and fall times < 10 ns. input pulse levels: 0.4 v and 2.4 v. timing measurements reference levels: inputs 1.0 v and 2.0 v. outputs 0.8 v and 2.0 v. 3.6 certificate of compliance . a certificate of compliance shall be required from a manufactu rer in order to be listed as an approved source of supply in mil-hdbk-103 (s ee 6.6 herein). the certificate of co mpliance submitted to dscc-va prior to listing as an approved source of supply sha ll affirm that the manufacturer's product meets the requirement s of mil-prf-38535, appendix a and the requirements herein. 3.7 certificate of conformance . a certificate of conform ance as required in mil-prf-38535, appendix a shall be provided with each lot of microcircuits delivered to this drawing. 3.8 notification of change . notification of change to dscc-va shall be requir ed for any change that affects this drawing. 3.9 verification and review . dscc, dscc's agent, and the acquiring activity re tain the option to review the manufacturer's facility and applicable required doc umentation. offshore documentat ion shall be made available ons hore at the option of the reviewer. 3.10 processing eeproms . all testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.10.1 erasure of eeproms . when specified, devices shall be erased in a ccordance with the procedures and characteristics specified by the manufacturer. 3.10.2 programmability of eeproms . when specified, devices shall be progra mmed to the specified pattern using the procedures and characteristics s pecified by the manufacturer and shall be made available upon request. 3.10.3 verification of erasur e or programmability of eeproms . when specified, devices shall be verified as either programmed to the specified pattern or eras ed. as a minimum, verification shall c onsist of performing a r ead of the entire arr ay to verify that all bits are in the proper state. any bit that does not verify to be in the proper state shall constitute a dev ice failure, and shall be removed from the lot or sample.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 9 dscc form 2234 apr 97 notes: 1. dimensions are in inches. 2. metric equivalents are for general information only. figure 1. case outline u . inches mm .002 0.05 .005 0.13 .008 0.20 .010 0.25 .012 0.30 .018 0.46 .050 1.27 .067 1.70 .075 1.90 .100 2.54 .180 4.57 .551 14.00 .650 16.51
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 10 dscc form 2234 apr 97 device types 01 through 05 case outlines x, z, u y terminal number terminal symbol 1 a14 nc 2 a12 a14 3 a7 a12 4 a6 a7 5 a5 a6 6 a4 a5 7 a3 a4 8 a2 a3 9 a1 a2 10 a0 a1 11 i/o0 a0 12 i/o1 nc 13 i/o2 i/o0 14 vss i/o1 15 i/o3 i/o2 16 i/o4 vss 17 i/o5 nc 18 i/o6 i/o3 19 i/o7 i/o4 20 ce i/o5 21 a10 i/o6 22 oe i/o7 23 a11 ce 24 a9 a10 25 a8 oe 26 a13 nc 27 we a11 28 vcc a9 29 ---- a8 30 ---- a13 31 ---- we 32 ---- vcc figure 2. terminal connections .
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 11 dscc form 2234 apr 97 device types 01 through 05 mode ce oe we i/o read v il v il v ih d out standby v ih x x high z chip clear v il v h v il x byte write v il v ih v il d in write inhibit x v il x high z/d out write inhibit x x v ih high z/d out v ih = high logic level v il = low logic level v h = chip clear high voltage x = don't care high z = high impedance state d in = data in d out = data out figure 3. truth table for unprogrammed devices .
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 12 dscc form 2234 apr 97 read cycle waveform figure 4. ac waveforms .
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 13 dscc form 2234 apr 97 we controlled byte write programming waveforms figure 4. ac waveforms - continued.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 14 dscc form 2234 apr 97 ce controlled byte write programming waveforms figure 4. ac waveforms - continued.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 15 dscc form 2234 apr 97 page write waveform figure 4. ac waveforms - continued.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 16 dscc form 2234 apr 97 chip clear waveform figure 4. ac waveforms - continued.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 17 dscc form 2234 apr 97 3.12 endurance . a reprogrammability test shall be completed as part of the vendor's reliability monitors. this reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the reprogrammability of the device. the methods and procedures may be vendor specific, but s hall guarantee the number of program/erase endurance cycles listed in se ction 1.3 herein over the full military temperature range. t he vendor's procedure shall be kept under document control and shall be made availabl e upon request of the acquiring or preparing activity, along wit h test data. 3.13 data retention . a data retention stress test shall be completed as part of the vendor's reliability monitors. this test shall be done for initial characterization and after any design or proc ess change which may affect data retention. the methods and procedures may be vendor specific , but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. the vendor 's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. 4. verification 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance mil-prf-38535, appendix a. 4.2 screening . screening shall be in accordance with method 5004 of mil-std-883, and shall be conducted on all devices prior to quality conformance inspection. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition d or f. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the prepar ing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissi pation, as applicable, in accordance with the intent specified in method 1015 of mil-std-883. (2) t a = +125c, minimum. (3) devices shall be burned-in containing a checkerboard pattern or equivalent. b. interim and final electrical test parameters shall be as specified in table ii herein, exc ept interim electrical paramete r tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 quality conformance inspection . quality conformance inspection shall be in accordance with method 5005 of mil-std- 883 including groups a, b, c, and d inspections. the following additional criteria shall apply. 4.3.1 group a inspection . a. tests shall be as specified in table ii herein. b. subgroups 5 and 6 in table i, met hod 5005 of mil-std-883 shall be omitted. c. subgroup 4 (c i and c o measurements) shall be measured for initial qua lification and after process or design changes which may affect capacitance. sample size is 15 devices, all input and output terminals tested, and no failures. d. as a minimum, subgroups 7 and 8 shall include verification of the truth table.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 18 dscc form 2234 apr 97 4.3.2 groups c and d inspections . groups c and d inspections shall be in accordance with method 5005 of mil-std-883 and as follows: a. end-point electrical parameters s hall be as specified in table ii herein. b. all devices requiring end-point elec trical testing shall be programmed with a checkerboard or equival ent alternating bit pattern. c. steady-state life test conditions, method 1005 of mil-std-883. (1) test condition d or f. the test circuit shall be main tained by the manufacturer under document revision level control and shall be made available to the prepar ing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of mil-std-883. (2) t a = +125c, minimum. (3) test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. 4.4 methods of inspection . methods of inspection shall be as specified in the appropriate tables of method 5005 of mil-std- 883 and as follows. 4.4.1 voltage and current . all voltages given are referenced to the microcircuit v ss terminal. currents given are conventional current and positive when flowing into the referenced terminal. 4.4.2 programming procedure . the programming procedures s hall be as specified by the device manufacturer and shall be made available on request. 4.4.3 erasing procedure . the erasing procedures shall be as specified by the device manufacturer and shall be made available on request. 4.4.4 software data protection . the software data protect proc edures shall be as specified by the device manufacturer and shall be made available on request. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38535, appendix a.
standard microcircuit drawing size a 5962-88634 defense supply center columbus columbus, ohio 43218-3990 revision level f sheet 19 dscc form 2234 apr 97 table ii. electrical test requirements . 1 / 2 / 3 / 4 / 5 / mil-std-883 test requirements subgroups (in accordance with mil-std-883, method 5005, table i) interim electrical parameters (method 5004) 1, 7, 9, or 2, 8a, 10 final electrical test parameters (method 5004) 1*, 2, 3, 7*, 8a, 8b, 9, 10, 11 group a test requirements (method 5005) 1, 2, 3, 4**, 7, 8a, 8b, 9, 10, 11 groups c and d end-point electrical parameters (method 5005) 1, 2, 3, 7, 8a, 8b, 9, 10, 11 1 / (*) indicates pda applies to subgroups 1 and 7. 2 / any or all subgroups may be combined when using multifunction testers. 3 / subgroups 7, 8a, and 8b shall c onsist of writing and reading the data pattern specified in accordance with the limits of table i, subgroups 9, 10, and 11. 4 / for all electrical tests, the device shall be programmed to the data pattern specified. 5 / (**) indicates that subgroup 4 will only be performed during initial testing and after design or process changes (see 4.3.1c). 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for gov ernment microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.1.1 replacability . microcircuits covered by this drawing will repl ace the same generic device covered by a contractor- prepared specificati on or drawing. 6.2 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be accomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users shall inform defens e supply center columbus (dscc) when a system application requires configuration control and the applicable smd. dscc will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronics devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.4 comments . comments on this drawing should be directed to dscc-va, columbus, ohio 43218-3990, or telephone (614) 692-0547. 6.5 approved sources of supply . approved sources of supply are listed in mil-hdbk-103. the vendors listed in mil-hdbk- 103 have agreed to this drawing and a certificate of complianc e (see 3.6 herein) has been subm itted to and accepted by dscc- va.
standard microcircuit drawi ng source approval bulletin date: 07-03-29 approved sources of supply for smd 5962- 88634 are listed below for immediate acqui sition information only and shall be added to mil-hdbk-103 and qml-38535 during the next revision. mil-hdbk-103 and qml-38535 will be revised to include the addition or deletion of sources. the v endors listed below have agreed to this drawi ng and a certificate of compliance has been submitted to and accepted by dscc-va. this information bulletin is superseded by the nex t dated revision of mil-hdbk-103 and qml-38535. dscc maintains an online databas e of all current sources of supply at http://www.d scc.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8863401ua 1fn41 at28hc256-12um/883 3/ tm28hc256-120 5962-8863401uc 3/ x28hc256kmb-12 5962-8863401xa 1fn41 at28hc256-12dm/883 34371 28hc256 3/ x28hc256dmb-12 3/ dm28hc256-120 5962-8863401ya 1fn41 at28hc256-12lm/883 3/ x28hc256emb-12 3/ lm28hc256-120 5962-8863401za 1fn41 at28hc256-12fm/883 3/ fm28hc256-120 5962-8863401zc 34371 28hc256 3/ x28hc256fmb-12 5962-8863402ua 1fn41 at28hc256fl-12um/883 3/ tm28hc256-120 5962-8863402xa 1fn41 at28hc256fl-12dm/883 3/ dm28hc256-120 5962-8863402ya 1fn41 at28hc256fl-12lm/883 3/ lm28hc256-120 5962-8863402za 1fn41 at 28hc256fl-12fm/883 3/ fm28hc256-120 5962-8863403ua 1fn41 at28hc256-90um/883 3/ tm28hc256-90 5962-8863403uc 3/ x28hc256kmb-90 5962-8863403xa 1fn41 at28hc256-90dm/883 34371 28hc256 3/ x28hc256dmb-90 3/ dm28hc256-90 5962-8863403ya 1fn41 at28hc256-90lm/883 3/ x28hc256emb-90 3/ lm28hc256-90 1of 2
standard microcircuit drawing source approval bulletin - continued. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8863403za 1fn41 at28hc256-90fm/883 3/ fm28hc256-90 5962-8863403zc 34371 28hc256 3/ x28hc256fmb-90 5962-8863404ua 1fn41 at28hc256f-90um/883 3/ tm28hc256-90 5962-8863404xa 1fn41 at28hc256f-90dm/883 3/ dm28hc256-90 5962-8863404ya 1fn41 at28hc256f-90lm/883 3/ lm28hc256-90 5962-8863404za 1fn41 at 28hc256f-90fm/883 3/ fm28hc256-90 5962-8863405ua 1fn41 at28hc256-70um/883 3/ tm28hc256-70 5962-8863405xa 1fn41 at28hc256-70dm/883 3/ dm28hc256-70 5962-8863405ya 1fn41 at28hc256-70lm/883 3/ lm28hc256-70 5962-8863405za 1fn41 at28hc256-70fm/883 3/ fm28hc256-70 1 / the lead finish shown for each pi n representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not lis ted contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the perfo rmance requirements of this drawing. 3 / no longer available from an approved source. vendor cage vendor name number and address 1fn41 atmel corporation 2325 orchard parkway san jose, ca 95131 - 1034 34371 intersil corporation 1001 murphy ranch road milpitas, ca 95035 - 5680 the information contained herein is disseminated for convenience only and the government assumes no liability what soever for any inaccuracies in this information bulletin. 2 of 2

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